{"id":10771,"date":"2024-09-25T16:10:24","date_gmt":"2024-09-25T08:10:24","guid":{"rendered":"https:\/\/www.ray-tron.com\/?p=10771"},"modified":"2024-09-25T16:10:24","modified_gmt":"2024-09-25T08:10:24","slug":"ele0013","status":"publish","type":"post","link":"https:\/\/www.ray-tron.com\/en\/ele0013\/","title":{"rendered":"What is the FPC production process like? How to ensure the quality of the product?"},"content":{"rendered":"

The production process of FPC (Flexible Printed Circuit Board) involves multiple steps, each of which is critical to the quality of the final product. The following is the general process and quality assurance measures for FPC production:<\/strong><\/p>\n

FPC production process<\/strong><\/p>\n

Design and proofing:<\/p>\n

Use CAD software to design circuits and determine the circuit diagram, number of layers, materials, dimensions, etc.<\/p>\n

Make a prototype for verification to ensure that the design meets the functional requirements.<\/p>\n

Materials preparation:<\/p>\n

Choose a suitable substrate (such as polyimide PI or polyester PET) and copper foil.<\/p>\n

Materials must undergo rigorous testing to ensure they meet standards.<\/p>\n

Film formation and photolithography:<\/p>\n

The photosensitive coating is applied to the surface of the substrate to form a photosensitive layer.<\/p>\n

Through exposure and development, a circuit pattern is formed.<\/p>\n

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